Newsletter

Audio DesignLine  >  Products

Conexant launches SoC line for embedded audio applications





Courtesy of eeProductCenter

Newport Beach, Calif.—Conexant Systems Inc. has launched an audio system-on-chip (SoC) product line for embedded audio and voice applications.

The CX2070X SoCs are targeted at growing audio opportunities in multimedia IP phones, personal navigation devices, portable media players, and mobile Internet devices. Additional applications include MP3 player docking stations, PC speaker systems, audio headsets, and unified communications systems that support services such as voice-over-IP telephony, speakerphone, and audio conferencing functionality. The highly integrated SoCs can also be used to enable audio capabilities in intercom and door phone applications.

The CX2070X SoCs include an integrated audio/voice digital signal processor (DSP), multi-bit codec, digital and analog input/out interfaces, and a power efficient 2.5-watt per channel Class-D amplifier to drive stereo speakers or optional post-width modulation (PWM) and differential line-out for external speaker systems amplifiers. Key features include Conexant-proprietary technical innovations that significantly improve audio and voice quality.

The CX2070X product family is packaged in a 76-pin quad flat no-lead (QFN) package.

Pricing: Ranges from $2.25 to $3.75 each in quantities of 10,000, depending on the feature set.
Availability: Shipping in pre-production quantities to customers now.
Product brief: CX20702.

Conexant, www.conexant.com



 
Related Links:
  • http://www.eeproductcenter.com/showArticle.jhtml?articleID=208402010
  • http://www.eeproductcenter.com/showArticle.jhtml?articleID=209400267
  • http://www.eeproductcenter.com/showArticle.jhtml?articleID=207801667






  • Related Content

    WEBINAR
    1. Achieve greater productivity and ease of use with Targeted Design Platforms enabled by Virtex-6 and Spartan-6 FPGAs

    WEBINAR
    2. Detecting Five Distinct Motions with MEMS Inertial Sensors

    WEBINAR
    3. Optimizing Noise in the Sensor Signal Path (Part III)

    COURSE
    4. Hands-on Training with the New TMS320VC5505 eZdsp USB Stick Development Tool

     


     Featured Jobs
    Accenture seeking Project Management Team Lead in Charlotte, NC

    Accenture seeking Software Engineer in Salt Lake City, UT

    Boeing Company seeking Software Engineer in Herndon, VA

    Switch and Data seeking Customer Solutions Engineer in Dallas, TX

    Chart Industries seeking Sr. Developer in Cleveland, OH

    More jobs on EETimesCareers
     Sponsor
     CAREER CENTER
    Ready to take that job and shove it?
    SEARCH JOBS:

     SPONSOR

     RECENT JOB POSTINGS
    For more great jobs, career related news, features and services, please visit EETimes' Career Center.