Design Center

Network engineering for audio engineers - Part 1: IP/Ethernet networking basics
Part 1 of an excerpt from the book "Audio Over IP" looks at basic IP/Ethernet networking fundamentals from an audio-over-IP-specific perspective.

• PSRR: The Real Story about Closed- and Open-Loop Class-D Amplifiers

• Improving battery life with ultra low-power codecs

• DSP Tricks: On odd way to build a simplified FIR filter structure

• Building an in-car MP3 player using Altium's NanoBoard

• Challenges in automotive radio design

Learning Center

Most Recent Courses

• Eliminating Audible Transients in Audio Systems
  Educast  15 Minutes
• TTI Kemet Electrolytic Capacitors for Power Applications
  Educast  15 Minutes
• TTI KEMET Facedown Capacitors
  Educast  15 minutes
• You've Got the Power: Toshiba's New UMOS-V MOSFET Family Boosts Power Efficiency
  Educast  10 Minutes
• Overview of WiMedia UWB Technology, Markets, and Opportunities
  Technology course  90 min
• Electromagnetic Compatibility Design for Power Supplies
  Technology course  60 min.
• What Every Designer Should Know About MOSFETs (up to 200V)
  Technology course  60 min.

Product Center

Latest Product Articles

• Tensilica targets high quality audio and smartphones with HiFi EP DSP core
• Wolfson launches ultra-low-power audio DAC
• Black anodized heatsinks increase thermal performance by 30 percent
• BI Technologies packs rotary potentiometers in guitar repair kit
• Wolfson launches multi-channel audio codec
• TI delivers high power, integrated Class-D audio amplifiers
• Wireless audio IC supports home, portable apps
• Stereo ADC solution offers high quality line input audio performance in recordable media applications
• Audio amplifier is more efficient than Class D
• USB host audio decoder ICs support a variety of audio compression formats
• High bandwidth switches and muxes suit Pro AV
• Conexant launches SoC line for embedded audio applications
• Microphone preamp chipset allows power vs. dynamic range tradeoff
• PDM digital-input class D audio amplifier taps portable apps
• TI introduces lowest cost DSP development tool
• Dual-channel bipolar audio op amp caters for professional audio market

Under the Hood

• Ear bud headphones jam lots of complexity in a tiny package
• Under the Hood: Sonos brings multi-zone digital audio to life
• Under the Hood: Wi-Fi latest in Sony's LocationFree feats
• Under the Hood: XM radio receiver makes waves
• Under the Hood: The MP3 that broke new ground

Technical Paper Library

Latest Technical Papers

• Digital Signal Processing: A Practical Guide (Part 2)
• Digital Signal Processing: A Practical Guide (Part 1)
• Viable distribution of Multi-channel Audio-over-IP for Live and Interactive Voice Talent
• Hi-Fi Audio: Unveiling the Hidden dBs
• Extend Battery Life in Mobile Applications using Innovative Audio Headphone Amplifiers
• All You Wanted to Know About Acoustic Echo Cancellation
• Harnessing the power of DSPs for VoIP

Featured Technical Papers

• Audio Guide
  Texas Instruments
• Keeping Up with the Expanding Demands of High-Performance Audio
  National Semiconductor
• Class D Amplifiers: Fundamentals of Operation and Recent Developments
  Maxim Integrated Products

Webinars

Latest Webinars

• Understanding and Optimizing Sampled Data Systems (Part I)
  Analog Devices and Digi-Key
• Detecting Five Distinct Motions with MEMS Inertial Sensors
  Analog Devices
• Designing an Efficient HD Audio Chip - Challenges and Considerations for DSP Selection
  CEVA
• Optimizing Noise in the Sensor Signal Path (Part III)
  Analog Devices and Avnet Electronics Marketing
• Achieve greater productivity and ease of use with Targeted Design Platforms enabled by Virtex-6 and Spartan-6 FPGAs
  Xilinx
• Understanding and Applying Digital Potentiometers
  Analog Devices and Digi-Key